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TAMURA SAM32-401E-13 Anisotropic conductive adhesive
TAMURA SAM32-401E-13 Anisotropic conductive adhesive
Introduction of SAM32-401E-13_ Anisotropic Conductive Bonding Agent-Solder Paste _TAMURA;
- It is a material for anisotropic conductive connection and a kind of anisotropic conductive bonding agent. Because it is used in soldering, it is emphasized as an anisotropic conductive adhesive.
SAM32-401E-13_ Anisotropic Conductive Bonding Agent-Solder Paste _TAMURA Features:
| Main constituent materials | "thermosetting resin" and "soldering" |
| character | tin cream |
| Connection application | FOB/FOF use |
| project |
SAM32-401E-13 |
||
| style | exterior | grey | |
| Solder particles | Alloy composition |
Sn42/Bi58 |
|
| Melting point (℃) |
139 |
||
|
grain size（μｍ） |
5-20 |
||
| Flux composition | Resin mold | resin | |
SAM32-401E-13_ Anisotropic Conductive Bonding Agent-Solder Paste _TAMURA Specifications:
| project |
SAM32-401E-13 |
| exterior | grey |
| Smearing method | spray |
| attended mode | Tin welding |
| resin | epoxy |
| Environmental correspondence |
Halogen free unleaded |
| Particle diameter |
5-20μｍ |
| Joint time |
≥6 seconds |
| Bonding temperature |
150℃ |
| Joint pressure |
1MPa |
| Corresponding connection density |
L/S=100μｍ/100μｍ |
|
retention time＜-10℃ |
6 months |
| Activation period |
30℃ 24h |
| insulance |
≥1.0E+8Ω |
| Peel strength (90° peel) |
initial stage：1.08N/mm TCT1000cyc：1.07N/mm THT1000h：1.14N/mm |
|
TCT（-40℃⇔125℃） |
on resistance：1000cyc O.K. |
|
THT（85℃ 85%RH） |
insulance：1000h O.K. |
