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Lead-free solder paste (special alloy)
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TAMURA SAM30-401E-15 Special solder paste for flip chip
TAMURA SAM30-401E-15 Special solder paste for flip chip
SAM30-401E-15_ Special Solder Paste for Flip Chip _ Introduction to _TAMURA:
- It is a material for anisotropic conductive connection and a kind of anisotropic conductive bonding agent. Because it is used in soldering, it is emphasized as an anisotropic conductive adhesive.
SAM30-401E-15_ Solder paste for flip chip _TAMURA Features:
| Main constituent materials | "thermosetting resin" and "soldering" |
| character | tin cream |
| Connection application | FOB/FOF use |
| project |
SAM30-401E-15 |
||
| style | exterior | grey | |
| Solder particles | Alloy composition |
Sn42/Bi58 |
|
|
melting point（℃） |
139 |
||
|
grain size（μｍ） |
5-20 |
||
| Flux composition | Resin mold | resin | |
SAM30-401E-15_ Solder paste for flip chip _TAMURA Specification parameters:
| project |
SAM30-401E-15 |
| exterior | grey |
| Smearing method | spray |
| attended mode | Tin welding |
| resin | epoxy |
| Environmental correspondence |
Halogen free unleaded |
| Particle diameter |
5-20μｍ |
| Pre-curing time | 10 seconds |
| Pre-curing temperature |
130℃ |
| Joint time | 15 seconds |
| Bonding temperature |
180℃ |
| Joint pressure |
3MPa |
| Corresponding connection density |
≥0.2mmP（L/S=100μｍ/100μｍ） |
|
retention time＜-10℃ |
6 months |
| Activation period |
30℃ 24h |
| insulance |
≥1.0E+8Ω |
|
Peel strength (90° peel) |
initial stage：0.72N/mm TCT1000cyc：0.75N/mm THT1000h：0.73N/mm |
|
TCT（-40℃⇔125℃） |
on resistance：1000cyc O.K. |
|
THT（85℃ 85%RH） |
insulance：1000h O.K. |
