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TAMURA TLF-286-GTS-VR5 high reliability lead-free solder paste

Brief introduction of Tamura TLF-286-GTS-VR5 lead-free solder paste;

  • Even under high temperature reflow, it shows good heat resistance, high reliability and high reliability solder paste, excellent effect of preventing parts from breaking, and the quality of cold and hot impact cyclic welding remains the same.
  • Pb-free (Sn/Ag/Cu/Bi/Sb system) solder alloy is used.
  • Excellent insulation characteristic can be obtained under the conditions of high temperature and high humidity.
  • Crack resistant flux residues.For the N2 reflow.

 

Specification parameters of TAMURA lead-free solder paste TLF-286-GTS-VR5

project

TLF-286-GTS-VR5

Experimental method
alloying component

Sn / Ag3.0 / Cu0.7 / Bi3.2 / Sb3.0 

JIS Z 3910(2017)

melting point

209~224℃

JIS Z 3198-1(2014)

Solder particle size

20~38μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3284-2(2014)

Flux content

11.5%

JIS Z 3197(2012) 

Halogen content

0%

JIS Z 3197(2012) 

viscosity

210Pa.s

JIS Z 3284-3(2014) 

Malcom PCU viscometer 25℃

 

 

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