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TAMURA TLF-206-107 Lead-free solder paste

Brief introduction to the characteristics of Tamura Tamura TLF-206-107 lead-free solder paste;

  • This product is made of lead-free solder alloy (tin/silver/copper).
  • The viscosity will not change with time during continuous printing, and it has good stability.
  • It can also show good stability when printing at high speed.
  • When printing, it still has good stability after a period of pause.
  • Can effectively reduce the void.
  • Can effectively improve the problem of solder paste collapse during preheating.
  • Lead-free welding shows good heat resistance even under high temperature reflow.
  • It also shows good welding performance on tiny parts with a spacing of 0.4 mm.

 

Tamura Tamura TLF-206-107 Lead-free Solder Paste Specifications:

project trait Experimental method
alloying component Sn95.5/Ag3.9/Cu0.6 JIS Z 3282(1999)
melting point 216~221℃ Using DSC detection
Particle size of tin powder (μm) 20~38μm Using laser light reflection method
Solder paste content (%) 88.8% JIS Z 3284(1994)
Halogen content (%) 0.0% JIS Z 3197(1999)
Viscosity (Pa·s) 180Pa.s

JIS Z 3284(1994)

 

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