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Lead-free solder paste (SAC305)
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TAMURA TLF-206-107 Lead-free solder paste
TAMURA TLF-206-107 Lead-free solder paste
Brief introduction to the characteristics of Tamura Tamura TLF-206-107 lead-free solder paste;
- This product is made of lead-free solder alloy (tin/silver/copper).
- The viscosity will not change with time during continuous printing, and it has good stability.
- It can also show good stability when printing at high speed.
- When printing, it still has good stability after a period of pause.
- Can effectively reduce the void.
- Can effectively improve the problem of solder paste collapse during preheating.
- Lead-free welding shows good heat resistance even under high temperature reflow.
- It also shows good welding performance on tiny parts with a spacing of 0.4 mm.
Tamura Tamura TLF-206-107 Lead-free Solder Paste Specifications:
project | trait | Experimental method |
alloying component | Sn95.5/Ag3.9/Cu0.6 | JIS Z 3282(1999) |
melting point | 216~221℃ | Using DSC detection |
Particle size of tin powder (μm) | 20~38μm | Using laser light reflection method |
Solder paste content (%) | 88.8% | JIS Z 3284(1994) |
Halogen content (%) | 0.0% | JIS Z 3197(1999) |
Viscosity (Pa·s) | 180Pa.s |
JIS Z 3284(1994) |