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Lead-free solder paste (SAC305)
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TAMURA TLF-206-93F Lead-free solder paste
TAMURA TLF-206-93F Lead-free solder paste
Brief introduction to the characteristics of Tamura Tamura TLF-206-93F lead-free solder paste;
- This product is made of lead-free solder alloy (tin/silver/copper).
- The viscosity will not change with time during continuous printing, and it has good stability.
- It also shows good welding performance on tiny parts such as CSP with a spacing of 0.5 mm.
- Use J-STD L0 flux, which has high reliability.
- Good welding performance, showing excellent wettability for various parts.
- Lead-free welding shows good weldability even under high temperature reflow conditions.
Tamura Tamura TLF-206-93F Lead-free Solder Paste Specifications:
| project | trait | Experimental method |
| alloying component | Sn95.5/Ag3.9/Cu0.6 | JIS Z 3282(1999) |
| melting point | 216~221℃ | Using DSC detection |
| Particle size of tin powder (μm) | 20~41μm | Using laser light reflection method |
| Tin powder shape | sphericity | JIS Z 3284(1994) |
| Flux content (%) | 11.6% | JIS Z 3284(1994) |
| Halogen content (%) | 0.0% | JIS Z 3197(1999) |
| Viscosity (Pa·s) | 200Pa.s |
JIS Z 3284(1994) |
