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Lead-free solder paste (SAC305)
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TAMURA TLF-204-93K Lead-free solder paste
TAMURA TLF-204-93K Lead-free solder paste
TLF-204-93K features:
- This product is made of lead-free solder alloy (tin/silver/copper);
- Tin beads around the chip are basically not generated;
- It also shows good welding performance on tiny parts such as CSP with a spacing of 0.5mm;
- The viscosity will not change with time during continuous printing, and it has good stability;
- Good welding performance, showing excellent wettability for various parts;
- Lead-free welding shows good heat resistance even under high temperature reflow.
TLF-204-93K specification:
| name of an article |
TLF-204-93K |
test method |
| Alloy composition (%) |
Sn96.5/Ag3.0/Cu0.5 |
JISZ3282(1999) |
| Melting point (℃) |
216-220 |
DSC determination |
| Solder particle size (μm) |
20-41 |
Laser analysis |
| Flux content (%) |
11.9 |
JISZ3284(1994) |
| Halogen content (%) | Below 0.1 |
JISZ3197(1999) |
| Viscosity (Pa·s) |
240 |
JISZ3284(1994) |
