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welding material
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Lead-free solder paste (SAC305)
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TAMURA TLF-204G-HFW Lead-free solder paste
TAMURA TLF-204G-HFW Lead-free solder paste
TLF-204G-HFW specialty:
- 1. Use fine powder below 15 μ m.
- 2. Excellent printability, and can adapt to the 0201 chip mounting mode.
- 3. Good wettability to micro-openings.
- 4. Use halogen-free flux
- 5. The flux residue after welding can be cleaned with water-based cleaning agent.
TLF-204G-HFW specification:
| name of an article |
TLF-204-75 |
test method |
| Alloy composition (%) |
Sn 96.5 / Ag 3.0 / Cu 0.5 |
JISZ3282(2006) |
| Melting point (℃) |
216-220 |
DSC determination |
|
Solder particle size（μm） |
5-15 |
Laser analysis |
|
Flux content（%） |
11.3 |
JISZ3197(2012) |
| Halogen content (%) |
0.0 |
JISZ3197(2012) |
|
viscosity（Pa·s） |
190 |
JISZ3284-3(2014) |
