TAMURA TLF-204F-171S lead-free solder paste
Solder paste TLF-204F-171S is a clean-free lead-free solder paste, which is made of spherical tin powder with little oxide and special flux. Because solder paste does not contain lead, it is very helpful to the environment and workplace protection. In addition, that sol paste still maintains excellent reliability even if the residue on the board is not remove.
TLF-204F-171S features:
- 1. Adopt lead-free (tin/silver/copper series) solder alloy.
- 2. The viscosity changes little during continuous printing, and the printing quality is stable.
- 3. It can show good wettability to parts.
- 4. Excellent solderability even at high peak temperature.
- 5. Excellent reliability even without cleaning flux residue.
TLF-204F-171S specification:
Item | Specificity | Trial prescription method |
alloying component | Tin 96.5/ Silver 3.0/Copper 0.5 |
JIS Z 3282(1999) |
melting point |
216~ 220 ℃ |
Using DSC detection |
Tin powder particle size |
10 ~30μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284(1994) |
Flux content |
12.5% |
JIS Z 3284(1994) |
chlorine | Below 0.05% |
JIS Z 3197 (1999) |
Viscosity |
210Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |