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Lead-free solder paste (SAC305)
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TAMURA TLF-204-167 Lead-free solder paste
TAMURA TLF-204-167 Lead-free solder paste
TAMURA lead-free solder paste TLF-204-167 Features:
- L This product is made of lead-free solder alloy (tin/silver/copper);
- L viscosity will not change with time during continuous printing, and it has good stability.
- L tin beads around the chip are basically not produced;
- L excellent solderability under high temperature reflow;
- L Excellent reliability can be obtained without cleaning flux residue.
TAMURA lead-free solder paste TLF-204-167 parameters:
| name of an article | trait | test method |
| alloying component |
Sn96.5/ Ag3.0/ Cu0.5 |
JISZ3282（1999） |
| melting point |
216~220oC |
DSC determination |
| Solder particle size |
20~38μm |
Laser analysis |
| Solder particle shape | sphericity |
Annex 1 to JIS Z 3284（1994） |
| Flux content |
11.7% |
JIS Z 3284（1994） |
| Halogen content |
0.0% |
JIS Z 3197（1999） |
| viscosity |
200Pa·s |
25℃ viscometer measurement |
