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welding material
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Lead-free solder paste (SAC305)
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TAMURA TLF-204-153 Lead-free solder paste
TAMURA TLF-204-153 Lead-free solder paste
Features of TLF-204-153:
- This product is made of lead-free solder alloy (tin/silver/copper);
- The viscosity will not change with time during continuous printing, and it has good stability;
- It also shows good welding performance on small parts such as CSP with a spacing of 0.3mm;
- Good welding performance, showing excellent wettability for various parts;
- Lead-free welding, even under the condition of high temperature reflow, shows good weldability;
- Can be used for air reflux and nitrogen reflux.
TLF-204-153 specification:
| name of an article |
TLF-204-153 |
test method |
|
Alloy composition（%） |
Sn96.5/Ag3.0/Cu0.5 |
JISZ3282(1999) |
|
melting point（℃） |
216-220 |
DSC determination |
| Solder particle size (μm) |
20-38 |
Laser analysis |
|
Flux content（%） |
11.8 |
JISZ3284(1994) |
|
Halogen content（%） |
0 |
JISZ3197(1999) |
|
viscosity（Pa·s） |
210 |
JISZ3284(1994) |
