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Lead-free solder paste (SAC305)
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TAMURA TLF287-171AT High reliability lead-free solder paste
TAMURA TLF287-171AT High reliability lead-free solder paste
Brief introduction of Tamura TLF287-171AT lead-free solder paste;
- Even under high temperature reflow, it shows good heat resistance, high reliability, high reliability solder paste and excellent effect of preventing parts from breaking.
- This product is made of lead-free solder alloy (tin/silver/copper), and the quality of cold and hot impact cycle welding remains the same.
- It also has excellent insulation characteristics under high temperature and high humidity.
- Can be used for atmospheric reflux.
TAMURA lead-free solder paste TLF287-171AT specification parameters
| project |
TLF287-171AT |
Experimental method |
| alloying component | Sn/Ag3.0/Cu0.7/Bi4.5/Sb5.0 system |
JIS Z 3910(2017) |
| melting point |
209~226℃ |
JIS Z 3198-1(2014) |
| Solder particle size |
20~38μm |
Using laser light reflection method |
| Tin powder shape | sphericity |
JIS Z 3284-2(2014) |
| Flux content |
12.0% |
JIS Z 3197(2012) |
| Halogen content | Below 0.05% |
JIS Z 3197(2012) |
| viscosity |
200Pa.s |
JIS Z 3284-3(2014) Malcom PCU viscometer 25℃ |
