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TAMURA TLF-204-21A Lead-free solder paste

TAMURA lead-free solder paste TLF-204-21A Features:

  • Excellent crack resistance to flux residue.
  • Lead-free (tin/silver/copper series) solder alloy is adopted.
  • It also has excellent insulation characteristics under high temperature and high humidity.
  • Used for N2 reflux.
  • Good weldability and sufficient wettability for gold-plated parts.
  • The viscosity changes little with time during continuous printing, and the printing quality is stable.
  • It also has good printability for tiny pads with a spacing of 0.4 mm.

 

TAMURA Lead-free Solder Paste TLF-204-21A Specifications

project

TLF-204-21A

Experimental method
alloying component Tin 96.5/ Silver 3.0/Copper 0.5

JIS Z 3282(1999)

melting point

216~ 220 ℃

Using DSC detection
Solder particle size

20 ~41μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3284(1994)

Flux content

11.3%

JIS Z 3284(1994)

Halogen content

0.0% 

JIS Z 3197 (1999)

viscosity

210  Pa.s

JIS Z 3284(1994)

Malcom PCU viscometer 25℃

 

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