Home Page
ꄲ
welding material
ꄲ
Lead-free solder paste (SAC305)
ꄲ
TAMURA TLF-204-21A Lead-free solder paste
TAMURA TLF-204-21A Lead-free solder paste
TAMURA lead-free solder paste TLF-204-21A Features:
- Excellent crack resistance to flux residue.
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- It also has excellent insulation characteristics under high temperature and high humidity.
- Used for N2 reflux.
- Good weldability and sufficient wettability for gold-plated parts.
- The viscosity changes little with time during continuous printing, and the printing quality is stable.
- It also has good printability for tiny pads with a spacing of 0.4 mm.
TAMURA Lead-free Solder Paste TLF-204-21A Specifications
project |
TLF-204-21A |
Experimental method |
alloying component | Tin 96.5/ Silver 3.0/Copper 0.5 |
JIS Z 3282(1999) |
melting point |
216~ 220 ℃ |
Using DSC detection |
Solder particle size |
20 ~41μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284(1994) |
Flux content |
11.3% |
JIS Z 3284(1994) |
Halogen content |
0.0% |
JIS Z 3197 (1999) |
viscosity |
210 Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |