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Lead-free solder paste (SAC305)
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TAMURA TLF-204-HSP Lead-free solder paste
TAMURA TLF-204-HSP Lead-free solder paste
TAMURA lead-free solder paste TLF-204-HSP Features:
- Excellent crack resistance to flux residue.
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- It also has excellent insulation characteristics under high temperature and high humidity.
- Used for N2 reflux.
- It also has good printability for tiny pads with a spacing of 0.3 mm.
TAMURA lead-free solder paste TLF-204-HSP specification parameters
| project |
TLF-204-HSP |
Experimental method |
| alloying component | Tin 96.5/ Silver 3.0/Copper 0.5 |
JIS Z 3282（1999） |
| melting point |
216~ 220 ℃ |
Using DSC detection |
| Solder particle size |
20 ~36μm |
Using laser light reflection method |
| Tin powder shape |
球状 |
JIS Z 3284（1994） |
| Flux content |
11.4% |
JIS Z 3284（1994） |
| Halogen content |
0.1% |
JIS Z 3197 (1999) |
| viscosity |
200 Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |
