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TAMURA TLF-204-49 Lead-free solder paste

TAMURA lead-free solder paste TLF-204-49 Features:

  • This product is made of lead-free solder alloy (tin/silver/copper).
  • Tin beads around the chip are basically not generated.
  • The viscosity will not change with time during continuous printing, and it has good stability.
  • It also shows good welding performance on micro-pitch parts.
  • Good welding performance, showing excellent wettability for various parts.
  • Lead-free welding shows good weldability even under high temperature reflow conditions.

 

TAMURA lead-free solder paste TLF-204-49 specification parameters

project

TLF-204-49

Experimental method
alloying component

Sn96.5/Ag3.0/Cu0.5

JIS Z 3282(1999)

melting point

216~ 220 ℃

Using DSC detection
Solder particle size

25~38μm

Using laser light reflection method
Flux content

11.7%

JIS Z 3284(1994)

Halogen content Below 0.05%

JIS Z 3197(1999)

viscosity

210 Pa.s

JIS Z 3284(1994)

 

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