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Lead-free solder paste (SAC305)
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TAMURA TLF-204-49 Lead-free solder paste
TAMURA TLF-204-49 Lead-free solder paste
TAMURA lead-free solder paste TLF-204-49 Features:
- This product is made of lead-free solder alloy (tin/silver/copper).
- Tin beads around the chip are basically not generated.
- The viscosity will not change with time during continuous printing, and it has good stability.
- It also shows good welding performance on micro-pitch parts.
- Good welding performance, showing excellent wettability for various parts.
- Lead-free welding shows good weldability even under high temperature reflow conditions.
TAMURA lead-free solder paste TLF-204-49 specification parameters
project |
TLF-204-49 |
Experimental method |
alloying component |
Sn96.5/Ag3.0/Cu0.5 |
JIS Z 3282(1999) |
melting point |
216~ 220 ℃ |
Using DSC detection |
Solder particle size |
25~38μm |
Using laser light reflection method |
Flux content |
11.7% |
JIS Z 3284(1994) |
Halogen content | Below 0.05% |
JIS Z 3197(1999) |
viscosity |
210 Pa.s |
JIS Z 3284(1994) |