TAMURA TLF-204-93 Lead-free solder paste

TAMURA lead-free solder paste TLF-204-93 Features:

• Lead-free (tin/silver/copper series) solder alloy is adopted.
• It also has good wettability for tiny pads with a spacing of 0.5mm, such as CSP.
• The viscosity changes little with time during continuous printing, and stable printing effect can be obtained.
• It has good weldability and can show good wettability for various parts.
• It belongs to lead-free solder paste and can show good reflow effect under the condition of high temperature reflow curve.

TAMURA lead-free solder paste TLF-204-93 specification parameters