TAMURA TLF-204-111A Lead-free solder paste

TAMURA lead-free solder paste TLF-204-111A Features:

• This product is made of lead-free solder alloy (tin/silver/copper).
• The viscosity will not change with time during continuous printing, and it has good stability.
• Can effectively reduce cavities.
• Lead-free soldering shows good heat resistance even under high temperature reflow.
• It also shows good welding performance on tiny parts such as CSP with a spacing of 0.5 mm.
• It can effectively reduce the phenomenon of flux splashing when welding gold-plated terminals.
• It shows good wettability even for gold-plated pads.
• Tin beads around the chip are basically not generated.

TAMURA lead-free solder paste TLF-204-111A specification parameters