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Lead-free solder paste (SAC305)
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TAMURA TLF-204-27F4 Lead-free solder paste
TAMURA TLF-204-27F4 Lead-free solder paste
TAMURA lead-free solder paste TLF-204-27F4 Summary:
- TAMURA lead-free solder paste TLF-204-27F4 is made of spherical tin powder with little oxide and special flux. Because it does not contain lead, it is of great help to the environment and workplace protection. In addition, even if the flux residue on the board is not removed and the carbonized water-based cleaning agent is used, the quasi-water-based cleaning agent still maintains excellent reliability.
TAMURA lead-free solder paste TLF-204-27F4 Features:
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- Using carbonized water-based detergent and quasi-water-based detergent, the cleaning effect is good.
- It also has good printability for tiny pads with a spacing of 0.4 mm.
- It can show good wettability for gold-plated parts.
- It belongs to lead-free solder paste and can show good reflow effect under the condition of high temperature reflow curve.
TAMURA lead-free solder paste TLF-204-27F4 specification parameters
project |
TLF-204-27F4 |
Experimental method |
alloying component | Tin 96.5/ Silver 3.0/Copper 0.5 |
JIS Z 3282(1999) |
melting point |
216~ 220 ℃ |
Using DSC detection |
Solder particle size |
10 ~25μm |
Using laser light reflection method |
Flux content |
11.9% |
JIS Z 3284(1994) |
Halogen content |
0.0% |
JIS Z 3197 (1999) |
viscosity |
180 Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |