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Lead-free solder paste (SAC305)
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TAMURA TLF-204-171C Lead-free and halogen-free solder paste
TAMURA TLF-204-171C Lead-free and halogen-free solder paste
Brief introduction of Tamura Tamura TLF-204-171C lead-free and halogen-free solder paste;
- Use lead-free (Sn/Ag/Cu system) solder alloy.
- In the process of continuous printing, the degradation over time is very small, and stable printing can be realized.
- Halogen-free solder paste using No.4 solder powder.
- Even if the preheating time is long, the solder can be melted on the small pad.
- No need to clean, with excellent reliability.
- It belongs to lead-free solder paste and can show good reflow effect under the condition of high temperature reflow curve.
Tamura Tamura TLF-204-171C Lead-free and Halogen-free Solder Paste Specifications:
project |
trait(TLF-204-171C) |
Experimental method |
alloying component |
Sn96.5/Ag3.0/Cu0.5 |
JIS Z 3282(1999) |
melting point (℃) |
216~220℃ |
Using DSC detection |
Solder particle size (μm) |
20~38 μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284(1994) |
Flux content |
12.2% |
JIS Z 3284(1994) |
chlorinity |
0.0% |
JIS Z 3197(1999) |
viscosity |
190Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |