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TAMURA TLF-204-171C Lead-free and halogen-free solder paste

Brief introduction of Tamura Tamura TLF-204-171C lead-free and halogen-free solder paste;

  • Use lead-free (Sn/Ag/Cu system) solder alloy.
  • In the process of continuous printing, the degradation over time is very small, and stable printing can be realized.
  • Halogen-free solder paste using No.4 solder powder.
  • Even if the preheating time is long, the solder can be melted on the small pad.
  • No need to clean, with excellent reliability.
  • It belongs to lead-free solder paste and can show good reflow effect under the condition of high temperature reflow curve.

 

Tamura Tamura TLF-204-171C Lead-free and Halogen-free Solder Paste Specifications:

project

trait(TLF-204-171C)

Experimental method
alloying component

Sn96.5/Ag3.0/Cu0.5

JIS Z 3282(1999)

melting point (℃)

216~220℃

Using DSC detection

Solder particle size (μm)

20~38 μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3284(1994)

Flux content

12.2%

JIS Z 3284(1994)

chlorinity

0.0%

JIS Z 3197(1999)

viscosity

190Pa.s

JIS Z 3284(1994)

Malcom PCU viscometer 25℃

 

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