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Lead-free solder paste (SAC305)
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TAMURA TLF-204-GT01 Low void/low bubble solder paste /low void solder paste
TAMURA TLF-204-GT01 Low void/low bubble solder paste /low void solder paste
Low void/low bubble solder paste/low void solder paste TLF-204-GT01 Features:
- Low cavity
- Good tin plating performance on various metals.
- The copper end face of QFN is well tinned.
- Good printability after placement.
Specification parameters of low void/low bubble solder paste/low void solder paste TLF-204-GT01:
| Metal composition |
Sn96.5/Ag3/Cu0.5 |
JIS Z 3282(2006) |
| Solid temperature/liquid temperature |
216℃/220℃ |
DSC |
| Tin powder particle size |
20～38 |
Laser foldback |
|
viscosity（Pa·ｓ） |
165±30 |
JIS Z 3284(2014) |
| Thixotropic index |
0.54±0.05 |
JIS Z 3284(2014) |
|
Flux content（％） |
11.4±0.3 |
JIS Z 3197(2012) |
| Flux type |
ROL0 |
IPC J-STD-004B |
|
Content of hydrochloric acid in flux（％） |
0.0% |
JIS Z 3197(2012) Potentiometric titration |
| Insulation impedance |
1E+09Ω以上 |
JIS Z 3284 (2014) 85℃/85% 1000h |
| Copper plate corrosion | Non-corrosive |
IPC J-STD-004B 40℃/90% 96hr |
| Bronze mirror experiment | Impermeability |
40℃/90% 96hr room temperature24h |
