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TAMURA LF-204-301S Lead-free solder paste

Brief introduction of Tamura LF-204-301S lead-free solder paste;

  • Use tiny solder powder of 12μm or less.
  • When precoating solder, the surface of solder has good wettability and uniformity.
  • This product conforms to IPC halogen-free solder paste specification.
  • Br<900 ppm, Cl<900 ppm and Br+Cl<1500 ppm in the solder paste.
  • Flux residue after reflow soldering can be removed by semi-water-based cleaning solvent.
  • General equipment can be used.

 

Specification parameters of TAMURA lead-free solder paste LF-204-301S

project

LF-204-301S

Experimental method
alloying component Sn96.5/Ag3/ Cu0.5 system (Symbol:204)

ICP

melting point

216~220℃

DSC

Solder particle size

1~12μm

Laser diffraction method
Flux content

30.50%

JIS Z 3284(2012) 

viscosity

170Pa.s

JIS Z 3284-3(1994) 

Malcom PCU viscometer 25℃

 

 

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