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Lead-free solder paste (SAC305)
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TAMURA LF-204-301S Lead-free solder paste
TAMURA LF-204-301S Lead-free solder paste
Brief introduction of Tamura LF-204-301S lead-free solder paste;
- Use tiny solder powder of 12μm or less.
- When precoating solder, the surface of solder has good wettability and uniformity.
- This product conforms to IPC halogen-free solder paste specification.
- Br<900 ppm, Cl<900 ppm and Br+Cl<1500 ppm in the solder paste.
- Flux residue after reflow soldering can be removed by semi-water-based cleaning solvent.
- General equipment can be used.
Specification parameters of TAMURA lead-free solder paste LF-204-301S
project |
LF-204-301S |
Experimental method |
alloying component | Sn96.5/Ag3/ Cu0.5 system (Symbol:204) |
ICP |
melting point |
216~220℃ |
DSC |
Solder particle size |
1~12μm |
Laser diffraction method |
Flux content |
30.50% |
JIS Z 3284(2012) |
viscosity |
170Pa.s |
JIS Z 3284-3(1994) Malcom PCU viscometer 25℃ |