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Lead-free solder paste (SAC305)
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TAMURA TLF-204-171 Lead-free solder paste
TAMURA TLF-204-171 Lead-free solder paste
TAMURA lead-free solder paste TLF-204-171 Features:
- Lead-free (tin/silver/copper) solder alloy is adopted.
- The viscosity changes little during continuous printing, and the printing quality is stable.
- It also has good weldability in atmospheric environment.
- Working at high temperature also has excellent weldability.
- No cleaning, and excellent reliability.
TAMURA lead-free solder paste TLF-204-171 specification parameters
| project |
TLF-204-171 |
Experimental method |
| alloying component |
Sn96.5/Ag3.0/Cu0.5 |
JIS Z 3282（1999） |
| melting point |
216~ 220 ℃ |
Using DSC detection |
| Solder particle size |
20 ~36μm |
Using laser light reflection method |
| Tin powder shape | sphericity |
JIS Z 3284（1994） |
| Flux content |
12.1% |
JIS Z 3284（1994） |
| Halogen content | Below 0.05% |
JIS Z 3197 (1986) |
| viscosity |
190 Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |
