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Lead-free solder paste (SAC305)
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TAMURA TLF-204-93KD Lead-free solder paste
TAMURA TLF-204-93KD Lead-free solder paste
Brief introduction of TAMURA Tamura TLF-204-93KD lead-free solder paste;
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- Little tin balls are produced.
- Good wettability can be obtained in CSP fine-tuning mode with a spacing of 0.4 mm.
- Small viscosity change during continuous printing and stable printing quality.
- Weldability, good wettability in all parts
- Excellent solderability even at high peak temperature.
TAMURA Tamura TLF-204-93KD Lead-free Solder Paste Specifications:
| project | trait | Experimental method |
| alloying component | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
| melting point | 216~220 ℃ | Using DSC detection |
| Particle size of tin powder (μm) | 20～41um | Using laser light reflection method |
| Tin powder shape | sphericity | JIS Z 3284(1994) |
| Flux content (%) | 11.9±0.3% | JIS Z 3284(1994) |
| Halogen content (%) | Below 0.10% | JIS Z 3197(1999) |
| Viscosity (Pa·s) | 200±40 Pa.s |
JIS Z 3284(1994) Malcom PCU Type a viscometer 25℃ |
| Aqueous solution resistance test | Above 2×104Ω.cm | JIS Z 3197(1999) |
| Insulation resistance test | Above 5×108Ω | JIS Z 3284(1994) |
| Fluidity test | Below 0.15mm |
The solder paste was printed on a porcelain substrate and heated at 150℃ for 60 seconds. The flow range is measured from the solder width before and after heating. STD-092b* |
| Solubility test | Several Wuxi balls occurred. |
The solder paste was printed on a porcelain substrate, melted and heated, and observed with a 50-fold microscope. STD-009e* |
| Solder diffusion test | Above 76% | JIS Z 3197(1986) |
| Copper corrosion test | Non-corrosive situation | JIS Z 3197(1986) |
| Tin slag viscosity test | qualified | JIS Z 3284(1994) |
