TAMURA TLF-204-111M Lead-free solder paste

TAMURA lead-free solder paste TLF-204-111M Features:

• This product is made of lead-free solder alloy (tin/silver/copper).
• The viscosity will not change with time during continuous printing, and it has good stability.
• Can effectively reduce cavities.
• Lead-free soldering shows good heat resistance even under high temperature reflow.
• Good weldability and sufficient wettability for gold-plated parts.
• Tin beads around the chip are basically not generated.
• The problem of solder paste collapse during preheating can be effectively improved.

TAMURA lead-free solder paste TLF-204-111M specification parameters