TAMURA TLF-204-191 Low bubble /low void solder paste/low void solder paste

Development Process of Low Bubble/Low Cavity Solder Paste TLF-204-191;

• Recently, due to space saving and low cost, there are many components with poor wettability, which are judged to be unqualified through equipment inspection. While ensuring the reliability, the maximum wettability development is achieved.

Development Concept of Low Bubble/Low Cavity Solder Paste TLF-204-191;

• Wettability of bad parts
• Wetting of various parent materials
• Reducing flux foam on phenolic paper substrate
• Reduce the void
• Can correspond to air backflow.

Specification parameters of low bubble/low void solder paste /low void solder paste TLF-204-191: