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Wafer handling manipulator/hand
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JEL SCR3160CS 3-axis cylindrical coordinate clean mechanical arm
JEL SCR3160CS 3-axis cylindrical coordinate clean mechanical arm
Characteristics of 3-axis cylindrical clean robot arm SCR3160CS;
- SCR3000CS series of 3-axis cylindrical coordinate clean robot arm for ultra-clean and dust-free room.
- Suitable for wafer handling in semiconductor production equipment and testing equipment.
- Standard arm length of mechanical arm: 100mm, 130mm, 160mm, 200mm.
- To meet the equipment requirements, you can choose the base fixing method or the flange fixing method.
- Equipped with action monitor
- Control communication mode: RS232C and parallel port I/O mode.
- The whole shaft adopts 2-phase stepping motor.
- S-curve acceleration and deceleration control mode can transport glass substrates at high speed and high precision.
- Wafer fixing methods: vacuum adsorption type, bottom support type, edge clamping type and Bernoulli non-contact type.
- Finger material: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials.
- Fingers can be provided according to the types of objects to be transported, equipment layout and other requirements.
Basic parameters of 3-axis cylindrical coordinate clean robot arm SCR3160CS;
operational environment | The atmospheric environment in the clean room |
arm | single-arm |
Arrival distance | 340mm (the distance from the center of the third joint of the arm) |
Maximum stroke of lifting shaft |
200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm |
Transportable quality | 3kg (reference at the third joint of the arm) |