JEL SCR3100S 4-axis cylindrical coordinate cleaning robot arm for small-diameter wafer

Characteristics of 4-axis cylindrical coordinate cleaning robot arm for SCR3100S small-diameter wafer;

• SCR3100S series of 3-axis cylindrical coordinate cleaning robot arm suitable for super clean room.
• It is suitable for carrying small-sized wafers in semiconductor production equipment and inspection equipment. By optimizing the space size of the robot arm,
• Conducive to the miniaturization of equipment.
• Methods to improve cleanliness: Install a 0.1µm filter at the exhaust port inside the arm.
• To meet the equipment requirements, you can choose the base fixing method or the flange fixing method.
• Equipped with action monitor
• Control communication mode: RS232C and parallel port I/O mode.
• The whole shaft adopts 2-phase stepping motor.
• S-curve acceleration and deceleration control mode can transport semiconductor wafers at high speed and high precision.
• Wafer fixing methods: vacuum adsorption type, bottom support type and edge clamping type.
• Finger material: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials.
• Fingers can be provided according to the actual situation of handling objects and the layout of customer equipment.

Basic parameters of 4-axis cylindrical coordinate cleaning robot arm for SCR3100S small-diameter wafer;