JEL SSCR3090S 3-axis cylindrical coordinate type cleaning robot arm for small-diameter wafer

Characteristics of 3-axis cylindrical coordinate cleaning robot SSCR3090S for small-diameter wafer;

• SSCR3090S series of 2-axis cylindrical coordinate clean robot arm for ultra-clean and dust-free room
• It is suitable for carrying small-sized wafers in semiconductor production equipment and inspection equipment. By optimizing the space size of the robot arm,
• Conducive to the miniaturization of equipment.
• Standard arm length of mechanical arm: 90mm
• Compatible with SSCR2090S-PM, the link arm can be customized without Z-axis module.
• Equipped with action monitor
• Control communication mode: RS232C and parallel port I/O mode.
• The whole shaft uses a 2-phase stepping motor.
• S-curve acceleration and deceleration control mode can transport semiconductor wafers at high speed and high precision.
• Wafer fixing methods: vacuum adsorption type, bottom support type.
• Finger material: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials.
• Fingers can be provided according to the types of objects to be transported, equipment layout and other requirements.

Basic parameters of 3-axis cylindrical coordinate cleaning robot SSCR3090S for small-diameter wafer;