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Wafer handling manipulator/hand
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JEL STCR4160S-F 4-axis cylindrical coordinate cleaning robot arm with turnover mechanism
JEL STCR4160S-F 4-axis cylindrical coordinate cleaning robot arm with turnover mechanism
Characteristics of 4-axis cylindrical coordinate clean manipulator STCR4160S-F with turnover mechanism;
- Using the Bernoulli principle mechanical finger made by JEL, the thinned wafer can be adsorbed.
- With high rigidity, the third joint of the arm can bear a load of 3kg (including fingers and things to be carried).
- The stepping motor is adopted to drive, which can effectively reduce power consumption and is beneficial to energy saving.
- Double mechanical finger structure can shorten the wafer exchange time.
- Double-armed with turnover mechanism
- According to the layout of the customer's equipment, the flange fixing method or the base fixing method can be selected.
Basic parameters of 4-axis cylindrical coordinate clean manipulator STCR4160S-F with overturning mechanism;
operational environment | The atmospheric environment in the clean room |
arm | arms |
Arrival distance | 315mm (the distance from the center of the third joint of the arm) |
Maximum stroke of lifting shaft |
200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm |
Transportable quality | 3kg (reference at the third joint of the arm) |