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Wafer laminating machine
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SINTAIKE STK-6120 Wafer Taper before semi-automatic wafer thinning
SINTAIKE STK-6120 Wafer Taper before semi-automatic wafer thinning
STK-6120 semi-automatic wafer laminating machine features:
- Desktop
- Suitable for 8 "&12" wafers.
- easy to operate
Performance of STK-6120 semi-automatic wafer laminating machine before thinning;
Wafer yield |
≥99.9% |
Tearing film quality | No bubbles (excluding dust particle bubbles) |
Hourly capacity | ≥ 75 wafers |
MTBF |
> 168 hours |
MTTR |
< 1 hour |
down time |
<3% |
Product replacement time | ≤ 5 minutes |
Specification parameters of STK-6120 semi-automatic wafer laminating machine before thinning:
Wafer size |
8”& 12”wafer |
Conventional product thickness |
300 ~750micron |
Wafer type | Silicon, gallium arsenide or other materials |
Film type |
Blue film or UV film (adhesion ≤8N/20mm) Width: 240 ~ 340mm Length: 100m Thickness: 0.05 ~ 0.2mm. |
Film sticking principle | Anti-static roller film, roller pressure adjustable. |
Film pasting action | Automatic film pulling and pasting |
Wafer platen | General (integrated) Teflon anti-static coating contact table can be heated: the table can be manually raised and lowered from room temperature to 100℃ |
Loading and unloading mode | Manual placement and removal of wafers |
Antistatic control | Anti-static Teflon coated wafer table/anti-static film roller/anti-static ion fan |
Cutting system | Straight cutter and ring cutter, 8 "and 12" have no function of cutting V notch, and the cutter can be heated at room temperature ~120℃. |
Wafer positioning | Pneumatic pin positioning |
control unit | Based on PLC control with 7 "touch screen. |
Safety protection | Configure the emergency stop button |
Power supply voltage | Phase alternating current 220V,10A |
compressed air | 5 kg of clean and dry compressed air with a flow rate of 100 l/min. |
machine casing | White plastic-sprayed metal shell |
volume | 670 mm (width) *1180 mm (depth) *1000 mm (including lamp height) |
net weight | 140 kg |