Home Page    Semiconductor    Wafer laminating machine    SINTAIKE STK-6120 Wafer Taper before semi-automatic wafer thinning
3

SINTAIKE STK-6120 Wafer Taper before semi-automatic wafer thinning

STK-6120 semi-automatic wafer laminating machine features:

  • Desktop
  • Suitable for 8 "&12" wafers.
  • easy to operate

 

Performance of STK-6120 semi-automatic wafer laminating machine before thinning;

Wafer yield

≥99.9%

Tearing film quality No bubbles (excluding dust particle bubbles)
Hourly capacity ≥ 75 wafers

MTBF

> 168 hours

MTTR

< 1 hour
down time

<3%

Product replacement time ≤ 5 minutes

 

Specification parameters of STK-6120 semi-automatic wafer laminating machine before thinning:

Wafer size

8”& 12”wafer

Conventional product thickness

300 ~750micron

Wafer type Silicon, gallium arsenide or other materials
Film type

Blue film or UV film (adhesion ≤8N/20mm)

Width: 240 ~ 340mm

Length: 100m

Thickness: 0.05 ~ 0.2mm.

Film sticking principle Anti-static roller film, roller pressure adjustable.
Film pasting action Automatic film pulling and pasting
Wafer platen General (integrated) Teflon anti-static coating contact table can be heated: the table can be manually raised and lowered from room temperature to 100℃
Loading and unloading mode Manual placement and removal of wafers
Antistatic control Anti-static Teflon coated wafer table/anti-static film roller/anti-static ion fan
Cutting system Straight cutter and ring cutter, 8 "and 12" have no function of cutting V notch, and the cutter can be heated at room temperature ~120℃.
Wafer positioning Pneumatic pin positioning
control unit Based on PLC control with 7 "touch screen.
Safety protection Configure the emergency stop button
Power supply voltage Phase alternating current 220V,10A
compressed air 5 kg of clean and dry compressed air with a flow rate of 100 l/min.
machine casing White plastic-sprayed metal shell
volume 670 mm (width) *1180 mm (depth) *1000 mm (including lamp height)
net weight 140 kg

 

Product Center

PRODUCT