SINTAIKE STK-7120 Wafer Mounter for semi-automatic wafer cutting and laminating machine
STK-7120 semi-automatic wafer cutting and laminating machine features:
- Desktop
- Suitable for 8 "&12" wafers.
- easy to operate
Performance of STK-7120 semi-automatic wafer cutting and laminating machine;
Wafer yield |
≥99.9% |
Film pasting quality | No bubbles (excluding dust particle bubbles) |
Hourly capacity | ≥ 80 wafers |
MTBF |
> 168 hours |
MTTR |
< 1 hour |
down time |
<3% |
Product replacement time | ≤ 5 minutes |
Specification parameters of STK-7120 semi-automatic wafer cutting and laminating machine;
Wafer size |
8”& 12”wafer |
Wafer thickness |
100~750micron |
Wafer type | Silicon, gallium arsenide or other materials |
Membrane type |
Blue film or UV film (adhesion ≤8N/20mm) Width: 300~400 mm Length: 100m Thickness: 0.05 ~ 0.2mm. |
Wafer bearing ring | 8 "and 12" disco standards |
Film sticking principle | Anti-static roller film, roller pressure adjustable. |
Film pasting action | Automatic film pulling and pasting |
Wafer platen |
General (integrated) Teflon anti-static coating contact table The platen can be heated: room temperature ~100℃ Manual lifting of table and tray |
Loading and unloading mode | Manual placement and removal of wafer/carrier ring |
Antistatic control | Anti-static Long Long coated wafer table/anti-static film roller/anti-static ion fan |
Cutting system | Manual track circular cutter and straight cutter. |
location mode | Wafer pneumatic pin positioning/load ring spring pin positioning |
control unit | Based on PLC control, with 7 "touch screen. |
Safety protection | Configure the emergency stop button |
Power supply voltage | Single-phase alternating current 220V,10A |
compressed air | 5 kg of clean and dry compressed air with a flow rate of 100 l/min. |
machine casing | White plastic-sprayed metal shell |
volume | 670 mm (width) *1180 mm (depth) *1000 mm (height) |
net weight | 140 kg |