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SINTAIKE STK-5120 Semi-automatic wafer thinning and film tearing machine Wafer Detaper

Characteristics of STK-5120 semi-automatic film tearing machine after wafer thinning:

  • Desktop
  • Suitable for 8 "-12" wafers.
  • easy to operate

 

Wafer yield

≥99.9%

Tearing film quality No lobes
Hourly capacity ≥ 80 wafers

MTBF

> 168 hours

MTTR

< 1 hour
down time

<3%

Product replacement time ≤ 5 minutes

 

Performance of STK-5120 semi-automatic film tearing machine after wafer thinning;

Wafer yield

≥99.9%

Tearing film quality No lobes
Hourly capacity ≥ 80 wafers

MTBF

> 168 hours

MTTR

< 1 hour
down time

<3%

Product replacement time ≤ 5 minutes

 

Specification parameters of STK-5120 semi-automatic film tearing machine after wafer thinning;

Wafer size

8”-12”Wafer wafer

Wafer thickness 150 ~750 microns
Wafer type Silicon, gallium arsenide or other materials
Tearing film type

Tearing tape

Width: 38 ~ 100mm

Length: 100m

Tearing angle < 45 degrees, and can be adjusted from 5 degrees to 45 degrees.
Wafer platen

General (integrated) Teflon anti-static coating contact table;

The platen can be heated: room temperature ~ 100℃;

Loading and unloading mode Manual placement and removal of wafers
Antistatic control Teflon anti-static coating contact table; Electrostatic ion removing fan
Wafer positioning Pneumatic pin positioning
control unit Based on PLC control and equipped with 7 "touch screen;
Drive unit Servo motor drive
Safety protection Configure the emergency stop button
Power supply voltage Single-phase alternating current 220V, 10A
compressed air 5 kg of clean and dry compressed air with a flow rate of 100 liters per minute.
machine casing White plastic-sprayed metal shell
volume 670 mm (width) *1180 mm (depth) *1000 mm (including lamp height)
net weight 130 kg

 

 

 

 

 

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