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TAMURA TLF-401-11 Lead-free solder paste
TAMURA TLF-401-11 Lead-free solder paste
Brief introduction of Tamura Tamura TLF-401-11 lead-free solder paste;
- This product is made of lead-free solder alloy (tin/bismuth)
- Common air can be used for reflow welding.
- The reflow soldering temperature is lower than that of Sn/Pb eutectic solder paste.
- The viscosity will not change with time during continuous printing, and it has good stability.
- Good welding performance, showing excellent wettability for various parts.
Tamura Tamura TLF-401-11 Lead-free Solder Paste Specifications:
| project | trait | Experimental method |
| alloying component | Sn42.0/Bi 58.0 | JIS Z 3282(1999) |
| melting point | 139℃ | Using DSC detection |
| Tin powder particle size (μm) | 25~45μm | Using laser light reflection method |
| Flux content (%) | 9.5% | JIS Z 3284(1994) |
| Halogen content (%) | 0.0% | JIS Z 3197(1999) |
| viscosity (Pa·s) | 210Pa.s |
JIS Z 3284(1994) |
