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Low temperature solder paste
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TAMURA TLF-801-17 Lead-free low temperature solder paste
TAMURA TLF-801-17 Lead-free low temperature solder paste
Brief introduction of Tamura Tamura TLF-801-17 lead-free solder paste;
- This product is made of lead-free solder alloy (tin/silver/copper series)
- Good weldability and wettability.
- Suitable for existing reflow soldering equipment.
- Very few tin balls are produced.
- Good welding performance, showing excellent wettability for various parts.
- The viscosity will not change with time during continuous printing, and it has good stability.
Tamura Tamura TLF-801-17 Lead-free Solder Paste Specifications:
| project | trait | Experimental method |
| alloying component | Sn88.0/Ag3.5/Bi0.5/In 8.0 | JIS Z 3282(1999) |
| melting point | 195~209 ℃ | Using DSC detection |
| Tin powder particle size (μm) | 20~41μm | Using laser light reflection method |
| Flux content (%) | 11.5% | JIS Z 3284(1994) |
| Halogen content (%) | 0.21% | JIS Z 3197(1999) |
| viscosity (Pa·s) | 220Pa.s |
JIS Z 3284(1994) |
