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Low temperature solder paste
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TAMURA TLF-402-13 Low temperature solder paste
TAMURA TLF-402-13 Low temperature solder paste
TAMURA low melting point solder paste TLF-402-13 features:
- Stable printability (good printability after placement)
- Good viscosity stability in continuous use.
- Low electrode void ratio
- Atmosphere-N2 atmosphere correspondence
TAMURA Low Melting Point Solder Paste TLF-402-13 Specification:
|
TLF-402-13 |
Experimental method | |
| Alloy composition |
Sn42/57Bi/1Ag |
JIS Z 3282(2006) |
|
Solder melting point（°C） |
137-139 |
DSC |
|
viscosity（Pa·s） |
200 |
JIS Z 3284-2(2014) |
|
Flux content（%） |
9.7 |
JIS Z 3197(2012) |
| Tin powder particle size |
20~38 |
Laser diffraction method |
| Insulation impedance |
More than 1ｘ10⁹ |
JIS Z 3197(2012) |
| Copper plate corrosion | Non-corrosive |
JIS Z 3197(2012) |
| Flux category |
ROLO |
J-STD 004B |
