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Low temperature solder paste
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TAMURA TLF-402-17 Low temperature solder paste
TAMURA TLF-402-17 Low temperature solder paste
Characteristics of Tamura TLF-402-17 Low Temperature Solder Paste;
- Stable printability (good printability after placement)
- This product adopts Sn-Bi-Ag alloy (Sn42Bi57Ag1) with melting point of 138~139℃
- When continuous printing, the viscosity printability is still good and the electrode void rate is low.
- Atmosphere corresponds to N2 atmosphere.
Specification parameters of TAMURA low temperature solder paste TLF-402-17
| project |
TLF-402-17 |
Experimental method |
| alloying component | Sn42/Bi57/ Ag1 system | direct-reading spectrometer |
| melting point |
138~139℃ |
DSC |
| Solder particle size |
20~38μm |
Laser diffraction method |
| Tin powder shape | sphericity |
JIS Z 3284-2(2014) |
| Flux content |
10.6% |
JIS Z 3197(2012) |
|
Insulation impedance（Ω） |
More than 1×108 |
JIS Z 3284 |
| viscosity |
180Pa.s |
JIS Z 3284-3(2014) Malcom PCU viscometer 25℃ |
