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welding material
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Low silver solder paste
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TAMURA GP-213-167 Lead-free and low silver solder paste
TAMURA GP-213-167 Lead-free and low silver solder paste
TAMURA lead-free low silver solder paste GP-213-167 Features:
- Excellent viscosity stability in continuous use.
- It also has stable weldability when used continuously.
- Bad control such as BGA
- The cavity can also be reduced under the electrode parts.
Specification parameters of TAMURA lead-free and low-silver solder paste GP-213-167
| project |
GP-213-167 |
Experimental method |
| alloying component |
98.3Sn/1.0Ag/0.7Cu |
|
| melting point |
217~ 224 ℃ |
Using DSC detection |
| viscosity |
200Pa·s |
JIS Z 3284(1994) |
| Thixotropic index |
0.53 |
JIS Z 3284(1994) |
| FLUX content |
11.9% |
JIS Z 3284(1994) |
| Halogen content |
0.0% |
JIS Z 3197(1999) |
| Tin powder particle size |
20～36μm |
Using laser light reflection method |
| Insulation resistance |
above1×109 Ω |
JIS Z 3284(1994) |
| Copper plate rot | Non-corrosive |
JIS Z 3197(1999) |
| Flux type |
ROL0 |
J-STD 004B |
