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Low silver solder paste
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TAMURA GP-211-167 Lead-free and Low Silver Solder Paste
TAMURA GP-211-167 Lead-free and Low Silver Solder Paste
Brief introduction of characteristics of Tamura Tamura GP-211-167 lead-free and low silver solder paste;
- Excellent viscosity stability in continuous use
- Stable weldability even in continuous use.
- Bad control such as BGA.
- Cavities can also be reduced under the electrode parts.
Tamura Tamura GP-211-167 Lead-free and Low Silver Solder Paste Specifications:
| name of an article | GP-211-167 | Experimental method |
| Alloy composition | 99.0Sn/0.3Ag/0.7Cu | |
| Melting point (℃) | 217～227 | DSC |
| Viscosity (Pa·s) | 200 | JIS Z 3284(1994) |
| Thixotropic index | 0.53 | JIS Z 3284(1994) |
| FLUX content (%) | 11.9 | JIS Z 3284(1994) |
| Halogen content (%) | 0.0 | JIS Z 3197(1999) |
| Tin powder particle size (μm) | 20～36 | Laser folding method |
| Insulation resistance (Ω) | More than 1×109 | JIS Z 3284(1994) |
| Copper plate corrosion | Rot-free food | JIS Z 3197(1999) |
| Flux type | ROL0 | J-STD 004B |
