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TAMURA TLF-204F-171S lead-free solder paste

Solder paste TLF-204F-171S is a clean-free lead-free solder paste, which is made of spherical tin powder with little oxide and special flux. Because solder paste does not contain lead, it is very helpful to the environment and workplace protection. In addition, that sol paste still maintains excellent reliability even if the residue on the board is not remove.

 

TLF-204F-171S features:

  • 1. Adopt lead-free (tin/silver/copper series) solder alloy.
  • 2. The viscosity changes little during continuous printing, and the printing quality is stable.
  • 3. It can show good wettability to parts.
  • 4. Excellent solderability even at high peak temperature.
  • 5. Excellent reliability even without cleaning flux residue.

 

TLF-204F-171S specification:

Item Specificity Trial prescription method
alloying component Tin 96.5/ Silver 3.0/Copper 0.5

JIS Z 3282(1999)

melting point

216~ 220 ℃

Using DSC detection
Tin powder particle size

10 ~30μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3284(1994)

Flux content

12.5%

JIS Z 3284(1994)

chlorine Below 0.05%

JIS Z 3197   (1999)

Viscosity

210Pa.s

JIS Z 3284(1994) Malcom PCU viscometer 25℃

 

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