TAMURA TLF-204-93IVT Lead-free solder paste

TLF-204-93IVT specialty:

• 1) Lead-free (tin/silver/copper series) solder alloy is adopted.
• 2) The viscosity changes little with time during continuous printing, and stable printing effect can be obtained.
• 3) Cavities can be effectively reduced.
• 4) It can effectively reduce the generation of solder balls between components.
• 5) Effectively improve the preheating fluidity.
• 6) It belongs to lead-free solder paste and can show good reflow effect under the condition of high temperature reflow curve.
• 7) It also has good wettability for tiny pads with a spacing of 0.5mm, such as CSP.

TLF-204-93IVT specification: