TAMURA TLF-204-171A Lead-free solder paste
TAMURA lead-free solder paste TLF-204-171A Summary:
- Solder paste TLF-204-171A is a clean-free lead-free solder paste, which is made of spherical tin powder with little oxide and special flux. Because solder paste does not contain lead, it is very helpful to the environment and workplace protection. In addition, that sol paste still maintains excellent reliability even if the residue on the board is not remove.
TAMURA lead-free solder paste TLF-204-171A Features:
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- The viscosity changes little during continuous printing, and the printing quality is stable.
- It can show good wettability to parts.
- Excellent solderability even at high peak temperature.
- Excellent reliability even without cleaning flux residue.
TAMURA lead-free solder paste TLF-204-171A specification parameters
project |
TLF-204-171A |
Experimental method |
alloying component | Tin 96.5/ Silver 3.0/Copper 0.5 |
JIS Z 3282(1999) |
melting point |
216~ 220 ℃ |
Using DSC detection |
Solder particle size |
20~38μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284(1994) |
Flux content |
12.1% |
JIS Z 3284(1994) |
chlorine |
0.0% |
JIS Z 3197 (1999) |
viscosity |
175 Pa.s |
JIS Z 3284(1994) Malcom PCU Type a viscometer 25℃ |