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TAMURA TLF-204-171A Lead-free solder paste

TAMURA lead-free solder paste TLF-204-171A Summary:

  • Solder paste TLF-204-171A is a clean-free lead-free solder paste, which is made of spherical tin powder with little oxide and special flux. Because solder paste does not contain lead, it is very helpful to the environment and workplace protection. In addition, that sol paste still maintains excellent reliability even if the residue on the board is not remove.

TAMURA lead-free solder paste TLF-204-171A Features:

  • Lead-free (tin/silver/copper series) solder alloy is adopted.
  • The viscosity changes little during continuous printing, and the printing quality is stable.
  • It can show good wettability to parts.
  • Excellent solderability even at high peak temperature.
  • Excellent reliability even without cleaning flux residue.

 

TAMURA lead-free solder paste TLF-204-171A specification parameters

project

TLF-204-171A

Experimental method
alloying component Tin 96.5/ Silver 3.0/Copper 0.5

JIS Z 3282(1999)

melting point

216~ 220 ℃

Using DSC detection
Solder particle size

20~38μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3284(1994)

Flux content

12.1%

JIS Z 3284(1994)

chlorine

0.0% 

JIS Z 3197 (1999)

viscosity

175  Pa.s

JIS Z 3284(1994)

Malcom PCU Type a viscometer 25℃

 

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