Home Page    Semiconductor    Wafer handling manipulator/hand    JEL MTCR4160 4-axis cylindrical coordinate clean robot arm
4

JEL MTCR4160 4-axis cylindrical coordinate clean robot arm

Characteristics of clean manipulator with MTCR4160_4 axis cylindrical coordinates;

  • 300mm wafer for ultra-clean and dust-free room corresponds to MTCR4000 series
  • Suitable for wafer handling in semiconductor production equipment and testing equipment.
  • The whole shaft adopts AC servo motor to meet the demand of high-speed transportation.
  • Compared with MTHR series, it has better cost performance advantage.
  • Standard arm length of mechanical arm: 160mm, 200mm.
  • The double-arm structure can shorten the arm action time when replacing wafers.
  • To meet the equipment requirements, you can choose the base fixing method or the flange fixing method.
  • Equipped with action monitor
  • Control communication mode: RS232C and parallel port I/O mode.
  • AC servo motor with absolute encoder specification for the whole shaft.
  • S-curve acceleration and deceleration control mode can transport semiconductor wafers at high speed and high precision.
  • Wafer fixing methods: vacuum adsorption type, bottom support type, edge clamping type and Bernoulli non-contact type.
  • Finger material: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials.
  • Fingers can be provided according to the types of objects to be transported, equipment layout and other requirements.

 

Basic parameters of 4-axis cylindrical coordinate clean manipulator MTCR4160;

operational environment The atmospheric environment in the clean room
arm arms
Arrival distance 315mm (the distance from the center of the third joint of the arm)
Maximum stroke of lifting shaft

300mm / 400mm / 500mm

Transportable quality 4kg (reference at the third joint of the arm)

 

Product Center

PRODUCT