SINTAIKE STK-6300 Fully Automatic Wafer Taper
STK-6300_Fully Automatic Wafer Taper Main Features:
- Advanced ESD roller taping
- Fully automatic tape feeding & mounting
- JEL Robot
- Wafer position intelligent mapping
- JEL Alignment
- ESD Teflon plating chuck to handle various wafer
- Wafer cassette & FOUP / FOSB loading & Unloading
- Automatic wafer edge profile cutting
- Standard industrial PC control with 17” touch panel LCD
- Full SST cover & door with aluminum profile frame
- Built-in Ionizers for ESD protection
- Non-UV & UV tape capability
- Standard configure dual load port
STK-6300_Fully Automatic Wafer Taper Main Specifications:
Control Unit |
Standard Industrial PC with 17” Touch Panel LCD Windows 7/10 Professional O/S |
Power Supplier |
Single Phase AC 220 V, 25A |
Air Supplier |
60 PSI CDA, 2.5 CFM |
UPH |
>= 45 PCs Wafer |
Conversion Time |
Changeover between wafer size: <= 30 Minutes |
Machine Construction |
Made of Full Aluminum Profile |
Machine Cover |
White plastic plating cover |
Dimensions |
1550 mm (W) × 1800 mm (D) × 1800 mm (H) |
Net Weight |
800Kg around |
STK-6300_Fully Automatic Wafer Taper Specifications:
Wafer Size |
Diameter:8” & 12” Thickness:>= 725 um |
Wafer Type |
Si, GaAs Single Flat or V-Notch |
Tape Type |
Blue Tape or UV Tape Width: 240 ~ 340 mm Length:100m Thickness: 0.05 ~ 0.2 mm |
Taping Chuck Temp. |
Room Temp. ~ 100 °C Controllable (Optional) |
Cutting System |
Multi-Axis Profile Cutter to Handling Various Wafer |
Cutter Blade Temp. |
Room Temp. ~ 120 ℃ Controllable |
Wafer Place Accuracy |
X-Y: +/- 0.2 mm, Θ : +/- 0.2° |
Input & Output |
Single Input Wafer Cassette / FOUP Single Output Wafer Cassette / FOUP |
EHS |
Ergonomics: SEMI S8-95 |
Safety |
SEMI S2-2000 / CE Standard Certifications:(Optional) |
MHS |
Wafer Cassette Load Port (E15.1) FIMS (E62) & BOLTS (E63) PGV Docking Zone (E64) Kinematic Coupling (E57) |
Communications |
Optional SECS / GEM |
ESD Control |
Teflon Plating Wafer Chuck / Tape Transfer Rollers/ESD Blower |
Wafer Robot |
JEL Alignment |