SINTAIKE STK-8050 semi-automatic temporary wafer bonder

Features of SINTAIKE semi-automatic temporary wafer bonder STK-8050:

• Corresponding wafer diameter: 4 "&6"&8 "/8"&12 "
• Loading and unloading mode: wafers are placed and taken out manually.
• Bonding mode: vacuum bonding
• Desk: one size wafer corresponds to one desk;
• Control unit: based on PLC control, with 7-inch touch screen.