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Wafer bonding and unbinding
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SINTAIKE STK-8061 semi-automatic wafer unbinding irradiator
SINTAIKE STK-8061 semi-automatic wafer unbinding irradiator
Features of semi-automatic wafer unbinding irradiator STK-8061:
- Corresponding wafer diameter: 4 "&6"&8 "/8"&12 "
- Loading and unloading mode: wafers/bearing rings are placed and taken out manually.
- Unbinding principle: laser unbinding;
- Laser head: Han nationality, automatic scanning
- Iron ring positioning: spring positioning pin
- Control unit: based on PLC control, with 7-inch touch screen.