SINTAIKE Wafer Bonding series wafer bonder

Introduction of wafer bonder Wafer Bonding series;

• Wafer bonder is used in Wafer Bonding/Debonding process.

Wafer Bonding Series Features of Wafer Bonding Machine:

• 4 "-8"/8 "-12" wafers are suitable for bonding extremely thin wafers.
• Optional vacuum hot pressing /UV/ laser bonding methods.
• Bonder intelligently maps wafers in the basket, which is compatible with loading and unloading of wafer basket and wafer box.
• Bonder supports wafer and product wafer for automatic alignment.
• The Wafer Bonding machine can automatically complete the wafer bonding process.
• Optional on-line inspection function after wafer bonding.
• Industrial computer +Windows system.
• SECS/GEM or simple networking capability.