SINTAIKE STK-6020 Wafer Taper before semi-automatic wafer thinning
STK-6020 semi-automatic wafer laminating machine features:
- Desktop
- Suitable for 4 "-8" wafers.
- easy to operate
Performance of STK-6020 semi-automatic wafer laminating machine before thinning;
| Wafer yield |
≥99.9% |
| Tearing film quality | No bubbles (excluding dust particle bubbles) |
| Hourly capacity | ≥ 80 wafers |
|
MTBF |
> 168 hours |
|
MTTR |
< 1 hour |
| down time |
<3% |
| Product replacement time | ≤ 5 minutes |
Specification parameters of STK-6020 semi-automatic wafer laminating machine before thinning:
| Wafer size | 4 "-8" wafer |
| Wafer thickness | 300 ~750 microns |
| Wafer type | Silicon, gallium arsenide or other materials |
| Film type |
Blue film or UV film (adhesion ≤8N/20mm) Width: 120 ~ 240mm Length: 100m Thickness: 0.05 ~ 0.2mm. |
| Film sticking principle | Anti-static roller film, roller pressure adjustable. |
| Film pasting action | Automatic film pulling and pasting |
| Wafer platen |
General (integrated) Teflon anti-static coating contact table The platen can be heated: room temperature ~100℃ Manual lifting of table and tray |
| Loading and unloading mode | Manual placement and removal of wafers |
| Antistatic control | Anti-static Teflon coated wafer table/anti-static film roller/anti-static ion fan |
| Cutting system | Straight cutter and ring cutter, 8 "without cutting V notch function, the cutter can be heated: room temperature ~120℃ |
| Wafer positioning | Pneumatic pin positioning |
| control unit | Based on PLC control, with 5.7 "touch screen. |
| Safety protection | Configure the emergency stop button |
| Power supply voltage | Phase alternating current 220V,10A |
| compressed air | 5 kg of clean and dry compressed air with a flow rate of 100 l/min. |
| machine casing | White plastic-sprayed metal shell |
| volume | 670 mm (width) *1180 mm (depth) *1000 mm (including lamp height) |
| net weight | 140 kg |
