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Wafer laminating machine
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SINTAIKE STK-5020 semi-automatic wafer thinning and film tearing machine Wafer Detaper
SINTAIKE STK-5020 semi-automatic wafer thinning and film tearing machine Wafer Detaper
Characteristics of STK-5020 semi-automatic film tearing machine after wafer thinning:
- Desktop
- Suitable for 4 "-8" wafers.
- easy to operate
Performance of STK-5020 semi-automatic film tearing machine after wafer thinning;
| Wafer yield |
≥99.9% |
| Tearing film quality | No lobes |
| Hourly capacity |
≥80 wafers |
|
MTBF |
>168 hours |
|
MTTR |
<1 hour |
| down time |
<3% |
| Product replacement time |
≤ 5 minutes |
Specification parameters of STK-5020 semi-automatic film tearing machine after wafer thinning;
| Wafer size | 4 "-8" wafer |
| Wafer thickness | 150 ~750 microns |
| Wafer type | Silicon, gallium arsenide or other materials |
| Tearing film type |
Tearing tape Width: 38 ~ 100mm Length: 100m |
| Tearing angle | < 45 degrees, and can be adjusted from 5 degrees to 45 degrees. |
| Wafer platen |
General (integrated) Teflon anti-static coating contact table; The platen can be heated: room temperature ~ 100℃; |
| Loading and unloading mode | Manual placement and removal of wafers |
| Antistatic control | Teflon anti-static coating contact table; Electrostatic ion removing fan |
| Wafer positioning | Pneumatic pin positioning |
| control unit | Based on PLC control and equipped with 7 "touch screen; |
| Drive unit | Servo motor drive |
| Safety protection | Configure the emergency stop button |
| Power supply voltage | Single-phase alternating current 220V, 10A |
| compressed air | 5 kg of clean and dry compressed air with a flow rate of 100 liters per minute. |
| machine casing | White plastic-sprayed metal shell |
| volume | 670 mm (width) *1180 mm (depth) *1000 mm (including lamp height) |
| net weight | 125 kg |
