SINTAIKE STK-7200V Automatic wafer cutting and laminating machine (vacuum) Wafer Mounter
Automatic wafer dicing machine (vacuum) STK-7200V Features:
- Special vacuum installation technology without roller (roller installation is optional)
- Equipped with imported multi-axis wafer handling robot arm.
- The thinner wafer can be pasted with the dicing film.
- Intelligent feedback of wafer position and warpage
- Computer control of 17-inch touch screen LCD industry
- Film pasting action: fully automatic film pulling and pasting, and waste film collection.
STK-7200V Fully Automatic Wafer Vacuum Mounter Specifications：
|
Wafer Size |
Diameter:4”, 5”, 6” & 8” |
|
Wafer Thickness |
80 ~ 750 um |
|
Wafer material |
Si, SiC |
|
Wafer Type |
Single Flat, Double Flat or V-Notch |
|
Tape Type |
Blue Tape or UV Tape Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm |
|
Frame Type |
6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified |
|
Mounting Theory |
Vacuum Mounting |
|
Wafer Place Accuracy |
X-Y: +/- 0. 1 mm Θ: +/- 0.1° |
|
Input & Output |
Dual Input Wafer Cassette / Single Output Frame Cassette |
|
ESD Control |
ESD Roller / ESD Wafer Chuck / ESD Ion Blower |
|
Wafer Transfer |
Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector Wafer Position & Warpage Intelligent Mapping in Cassette |
|
Wafer Alignment |
Fiber Sensor for Wafer Alignment |
|
Control Unit |
Standard Industrial PC with 17” Touch Panel LCD / Windows O/S |
|
Power Supplier |
Single Phase AC 220 V, 25A |
|
Air Supplier |
5.0 Kgf/cm2 CDA, 150 L/min |
|
Machine Construction |
Made of Full Aluminium Profile |
|
Dimensions |
1750 mm (W) × 1350 mm (D) × 1800 mm (H) |
|
Net Weight |
870 Kg |
