SINTAIKE STK-7200R Automatic wafer cutting and laminating machine (roller) Wafer Mounter
STK-7200R_SINTAIKE automatic wafer cutting and laminating machine (roller) Features:
- Fully automatic wafer/frame loading and unloading
- Japan imported wafer handling robot arm, wafer alignment system
- Full-automatic wafer pasting
- Electroplating contact wafer chuck with marked ESD Teflon
- Dealing with DBG process: Tear BG film after sticking film.
- Film pasting action: automatic film pulling and pasting.
- Wafer table: universal (integrated) Teflon anti-static coating contact table; Or a silica gel table or a ceramic table.
STK-7200R Fully Automatic Wafer Roller Mounter Specifications：
|
Wafer Size |
Diameter: 6” 、8 |
|
Wafer Thickness |
150 ~ 725 um |
|
Wafer material |
Si, SiC |
|
Wafer Type |
Single Flat, Double Flat or V-Notch |
|
Tape Type |
Blue Tape or UV Tape Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm |
|
Frame Type |
6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified |
|
Mounting Theory |
Roller Mounting |
|
Wafer Place Accuracy |
X-Y: +/- 0. 1 mm Θ: +/- 0.1° |
|
Input & Output |
Dual Input Wafer Cassette / Single Output Frame Cassette |
|
ESD Control |
ESD Roller / ESD Wafer Chuck / ESD Ion Blower |
|
Wafer Transfer |
Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector Wafer Position & Warpage Intelligent Mapping in Cassette |
|
Wafer Alignment |
Fiber Sensor for Wafer Alignment |
|
Control Unit |
Standard Industrial PC with 17” Touch Panel LCD / Windows O/S |
|
Power Supplier |
Single Phase AC 220 V, 25A |
|
Air Supplier |
5.0 Kgf/cm2 CDA, 150 L/min |
|
Machine Construction |
Made of Full Aluminium Profile |
|
Dimensions |
1750 mm (W) × 1350 mm (D) × 1800 mm (H) |
|
Net Weight |
870 Kg |
