OKAMOTO GNX200B wafer grinder/thinner/grinder

OKAMOTO GNX200B wafer grinder features: 

• The mechanical precision of spindle is adjustable.
• Okamoto self-produced cast gold integrated structure, not easy to age, lasting precision.
• The lubrication system is well protected to prevent foreign objects from entering and causing abrasion.
• Applicable wafer size: 4 ",5", 6 "and 8" Maximum wafer thickness: 1000μm m.
• Can switch full-automatic and semi-automatic operation modes.
• 17-inch touch operation and monitoring screen, monitoring air pressure, current, water flow, thickness, etc.
• The consumption of grinding consumables is small and the processing cost is low.
• Grinding silicon chips are fine, and the washing is cleaner.

OKAMOTO GNX200B wafer grinder features: